TSMC Uses Advanced 28-nanometer Technology in Early 2010

The smaller circuitry allows the design of more powerful chips for more complex devices, and the squeezing of more circuits onto a single chip, which will increase chip yield per wafer, boosting efficiency.

Taiwan Semiconductor Manufacturing Company Co Ltd (abbrev. TSCM), which is the world's largest contract chip maker, said on Tuesday it would start using advanced 28-nanometer technology in early 2010 to manufacture chips used in new, higher-performance tech gadgets.

According to Jason Chen, a TSMC vice president, product differentiation, faster time-to-market and investment optimization are the three most important values for the company’s customers. Chen added, in support of the values that he had mentioned before, the company is developing the new comprehensive 28nm technology family so that it offers choices, depending on the customer applications and performance requirements.

In a highly competitive foundry market, TSCM, United Microelectronics Corp (UMC) and other smaller competitors are racing to invent new process technology for chip production. According to TSCM, the new technology that will support applications like wireless connectivity cellular base band, is expected to provide up to 50% more speed or 30-50% lower power consumption than TSMCs' 40-nanometer low-power node.

A Hsinchu (Taiwan)-based TSMC, which counts Nvidia and Texas Instruments among its major clients, has been driving process technology to advanced 90-, 65- and 45-nanometer as next-generation electronics devices such as game consoles and mobile phones require more powerful processor chips. In addition, the smaller circuitry allows the design of more powerful chips for more complex devices, and the squeezing of more circuits onto a single chip, which will increase chip yield per wafer, boosting efficiency.

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